ITherm 2008

ITherm 2008 (http://www.ithermconference.org) is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems.  ITherm 2008 will be held along with the 58th Electronic Components and Technology Conference (ECTC 2008, http://www.ectc.net), a premier electronic packaging conference, located in the Disney Park at Disney’s Contemporary Resort.  Based on the success of ITherm 2006, papers will be presented in stand-up and selected topical poster sessions.  Poster sessions, which allow a high level of author/audience interaction, will play a major role in this and future ITherm conferences.  All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings.  In addition to paper presentations and vendor exhibits, ITherm 2008 will include panel discussions, keynote lectures by prominent speakers, and professional short courses. Original papers are solicited in the general areas of (but not limited to):

Thermal Management:
• Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface Materials
• Natural and Forced Convection Air Cooling
• Advances in Compact Air Movers
• Single Phase Liquid Cooling
• Novel Phase Change Cooling Techniques: Boiling, Heat Pipes, Thermosyphon, Spray and Jet Impingement
• Microfabricated Thermal Management Devices and Systems
• Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption, Adsorption, Thermo-acoustic, Magnetocaloric
• Thermal Management in Wireless, Networking, Computing, Lighting, Harsh Environments, and Peripheral Hardware.
• Thermal and Energy Management in Data Centers
• Three-Dimensional Electronics
• Advances in Experimental Characterization
• Advances in Computational Characterization: Multi-Scale Modeling, Compact Modeling, Multi-Physics Modeling,
      Multi-Objective Design and Optimization

Mechanics:
• Modeling and Simulation for Reliability at Package, Board, and System Levels
• Failure Mechanics and Damage Modeling
• Experimental Techniques
• Constitutive Models
• Impact, Drop and Vibrational Analysis of Packages, Sub-Systems, and Systems
• Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
• Materials
  Design, Synthesis, and Processing of Materials for Thermal/Thermo-Mechanical Management in Electronic Systems
  Thermo-Mechanical Characterization and Modeling of Packaging Materials
  Material Interfaces: Engineering  Characterization and Simulation

Emerging Technologies: 
• Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
• Nanotechnology: Thermal, Mechanics, Material and Process Related Issues in Nanostructures
• Micro-Fluidics
• Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
• MEMS: Device and Package Level Reliability Issues
• Integrated Biochips and Bioelectronics
• Medical, Telecommunication, and Automotive Systems
• Space Systems: Earth Orbiting and Deep-Space Missions

Panel Discussions:
• Proposals are solicited for panel discussion topics addressing contemporary issues of broad interest to the ITherm community. These should include a title, an abstract describing the theme(s) to be addressed, and a list of potential panelists.

Abstract and subsequent paper submissions are entirely web-based, with the following deadlines.  Please submit a 400 word text-only (no figures and tables) abstract to ITherm website: http://www.ithermconference.org.  The Abstracts will be considered for oral or poster sessions.  The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance.