Energy Efficient Thermal Management of Data Centers
Yogendra Joshi
Georgia Institute of Technology
Course Description (2 hrs):
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Employing Innovative Cooling Technologies in Present and Future Electronic Products
Gamal Refai-Ahmed, Ph.D., Fellow ASME, AMD Fellow, AMD Inc
Professor Dereje Agonafer, Ph. D., Fellow ASME, University of Texas at Arlington
Professor Bahgat Sammakia, Ph.D., Fellow ASME, Binghamton University
Course Description (4 hrs):
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Constitutive and Failure Behavior of SnAgCu Solder Joints
Ganesh Subbarayan
School of Mechanical Engineering, Purdue University
Dhruv Bhate
Intel Corporation
Course Description (2hrs):
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High Resolution Thermal Metrology for Electronic Systems
Kenneth Goodson
Professor of Mechanical Engineering
Stanford University
Course Description (2 hrs):
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An Introduction to the Analysis of Delamination in IC Packages Using Fracture Mechanics
Dr Andrew Tay, Professor of Mechanical Engineering, National University of Singapore
Course Description (2 hrs):
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Carbon Nanotube and Graphene Nanoribbon Interconnects
Azad Naeemi
Georgia Institute of Technology, Atlanta, GA
Course Description (2 hrs):
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Mechanics of Interfaces in Microelectronic Packaging
Professor Jianmin Qu, Woodruff School of Mechanical Engineering, Georgia Institute of Technology
Course Description (2 hrs):
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Thermal Engineering of Phase Change Random Access Memory (PCRAM) Devices
Mehdi Asheghi and Ken Goodson
Mechanical Engineering Department, Stanford University, Stanford, CA 94305
Course Description (2 hrs):
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On-Chip Thermal Management and Hot Spot Remediation
Professor Avram Bar-Cohen
Department of Mechanical Engineering
University of Maryland
Course Description (2 hrs):
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Advanced Cooling Technologies for Next-Generation Microelectronics Systems
Suresh V. Garimella, Purdue University
Course Description (2 hrs):
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Measurement Techniques in the Thermal Management of Electronics
Seri Lee, Ph.D.
Nextreme Thermal Solutions, Inc.
Course Description (2hrs):
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